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IPO Snapshot    
Bondada Engineering Ltd.
Issue Open Date 18-Aug-23  
Issue Closing Date 22-Aug-23  
Application Money 100  
Allotment Money  
Price Band 75 -  
Minimium Application No. 1600  
Issue Size (Shares) 5696000  
Market Lot 1.00  
Objective
1. To meet long-term working capital requirements.2. General Corporate Purposes.
Category No. of Shares No. of Shares Subscription Ratio
  Offered / Reserved Bid For  
Non-Institutional Investors     312491200   NA  
Qualified Institutional Buyers     24460800   NA  
Retail Individual Investors     270547200   NA  
Business Description
We provide passive telecom infrastructure services which include turnkey services for cell site construction,erection, operation and maintenance of telecom towers with civil, electrical, and mechanical works; supply ofpoles and towers, laying and maintenance o
more...
Promoter's Holding
Total Share Capital   13680000  
Offered to Public   5696000  
Promoter's Holding (Pre-Issue)   86  
Promoter's Holding (Post-Issue)    
Address
1-1-27/37
Ashok Manoj Nagar
Kapra
Hyderabad ,
Telangana ,
500062
Phone:7207034662
Email:cs@bondada.net
Website: www.bondada.net
Registrar
K FIN Technologies Ltd.-(Karvy Fintech Pvt Ltd.)
Karvy Selenium Tower B
Plot 31-32
Gachibowli
Financial District
Nanakramguda
Hyderabad
Listed at
BSE
Lead Manager
Vivro Financial Services Pvt Ltd
Promoters
Neelima Bondada
Raghavendra Rao Bondada
Satyanarayana Baratam